A very thin silicon chip is bonded to a 6-mm thick aluminum substrate by a 0.02-mm thick epoxy glue. Both surfaces of this chip-aluminum system are cooled by air at 250C, where the convective heat transfer coefficient of air flow is 100 W/(m2 K). If the heat dissipation per unit area from the chip is 104 W/m2 under steady state condition, draw the thermal circuit for the system and determine the operating temperature of the chip.
GIVEN
Silicon chip bonded to 6-mm thick aluminum substrate bye 0.02-mm thick epoxy glue
Air temperature(T?)=250C
Convective heat transfer coefficient(h?)=100 W/(m2 K)
Heat dissipation from chip(q/A)= 104 W/m2
FIND
Draw thermal circuit of system
Operating temperature of the chip.
ASSUMPTIONS
1-Dimensional Steady state conditions prevail
Negligible heat loss from the sides
Isothermal chip
Negliglble radiation
SKETCH
From the figure
Total heat transferred to the surrounding is sum of heat transferred from upper surface and lower
surface. Thus
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