A very thin silicon chip is bonded to a 6-mm thick aluminum substrate by a 0.02-mm thick epoxy glue. Both surfaces of this chip-aluminum system are cooled by air at 250C, where the convective heat transfer coefficient of air flow is 100 W/(m2 K). If the heat dissipation per unit area from the chip is 104 W/m2 under steady state condition, draw the thermal circuit for the system and determine the operating temperature of the chip.

GIVEN

Silicon chip bonded to 6-mm thick aluminum substrate bye 0.02-mm thick epoxy glue

Air temperature(T?)=250C

Convective heat transfer coefficient(h?)=100 W/(m2 K)

Heat dissipation from chip(q/A)= 104 W/m2

FIND

Draw thermal circuit of system

Operating temperature of the chip.

ASSUMPTIONS

1-Dimensional Steady state conditions prevail

Negligible heat loss from the sides

Isothermal chip

Negliglble radiation

SKETCH


From the figure

Total heat transferred to the surrounding is sum of heat transferred from upper surface and lower

surface. Thus



Physics & Space Science

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