In thermal management or cooling of microchip modules for high-powered computer systems, very high heat fluxes have to be accommodated in the design of the cooling method. For many such cases, immersion cooling via pool boiling in a dielectric fluid is often employed [94]. In a pool boiling experiment to evaluate the cooling behavior from a simulated chip module, water is boiled at atmospheric pressure over a submerged emery-polished copper-plate heater. If the surface excess temperature is measured to be 14.5 K, what is the heat flux dissipated by boiling from the copper plate?
GIVEN
? Water at atmospheric pressure boiling on emery-polished copper-plate heater
? Surface excess temperature (?Tx)= 14.5 K
FIND
(a) Heat flux dissipated by boiling from copper plate.
PROPERTIES AND CONSTANTS
From Appendix 2, Table 13, the properties of water at 100°C are
The coefficient for the emery polished copper-plate surface (Csf)= 0.0128
Solving Equation (9.2) for q” we have
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