Planet A has twice the mass of Planet B. From this information, what can we conclude about the acceleration due to gravity at the surface of Planet A compared to that at the surface of Planet B?
A) The acceleration due to gravity on Planet A is greater than the acceleration due to gravity on Planet B, but we cannot say how much greater.
B) The acceleration due to gravity on Planet A must be four times as great as the acceleration due to gravity on Planet B.
C) The acceleration due to gravity on Planet A must be twice as great as the acceleration due to gravity on Planet B.
D) The acceleration due to gravity on Planet A is the same as the acceleration due to gravity on Planet B.
E) We cannot conclude anything about the acceleration due to gravity on Planet A without knowing the radii of the two planets.
E
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If a comet's ion tail is pointing perpendicular to its direction of travel, the comet is
A) close to or at aphelion. B) moving away from the Sun. C) close to or at perihelion. D) moving closer to the Sun. E) A comet's tail never points perpendicular to its motion.
A boy and a girl are riding on a merry-go-round that is turning. The boy is twice as far as the girl from the merry-go-round's center
If the boy and girl are of equal mass, which statement is true about the boy's moment of inertia with respect to the axis of rotation? A) His moment of inertia is 4 times the girl's. B) The boy has a greater moment of inertia, but it is impossible to say exactly how much more. C) His moment of inertia is twice the girl's. D) His moment of inertia is half the girl's. E) The moment of inertia is the same for both.
A very thin silicon chip is bonded to a 6-mm thick aluminum substrate by a 0.02-mm thick epoxy glue. Both surfaces of this chip-aluminum system are cooled by air at 250C, where the convective heat transfer coefficient of air flow is 100 W/(m2 K). If the heat dissipation per unit area from the chip is 104 W/m2 under steady state condition, draw the thermal circuit for the system and determine the operating temperature of the chip.
GIVEN
Silicon chip bonded to 6-mm thick aluminum substrate bye 0.02-mm thick epoxy glue
Air temperature(T?)=250C
Convective heat transfer coefficient(h?)=100 W/(m2 K)
Heat dissipation from chip(q/A)= 104 W/m2
FIND
Draw thermal circuit of system
Operating temperature of the chip.
ASSUMPTIONS
1-Dimensional Steady state conditions prevail
Negligible heat loss from the sides
Isothermal chip
Negliglble radiation
SKETCH
Two identical bar magnets are placed rigidly and anti-parallel to each other as shown. At what locations, if any, is the net magnetic field close to zero?